US 11,837,565 B2
Devices including coax-like electrical connections and methods for manufacturing thereof
Saqib Kaleem, Munich (DE); Jonas Eric Sebastian Fritzin, Munich (DE); Martin Dechant, Graz (AT); and Pietro Brenner, Ebersberg (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jul. 22, 2021, as Appl. No. 17/443,204.
Claims priority of application No. 102020122073.1 (DE), filed on Aug. 24, 2020.
Prior Publication US 2022/0059487 A1, Feb. 24, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01)
CPC H01L 24/14 (2013.01) [H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/1411 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14141 (2013.01); H01L 2224/16225 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A device, comprising:
a semiconductor chip comprising an electrical contact arranged on a main surface of the semiconductor chip;
an external connection element configured to provide a first coax-like electrical connection between the device and a printed circuit board, wherein the first coax-like electrical connection comprises a section extending in a direction vertical to the main surface of the semiconductor chip, and wherein the printed circuit board comprises a coplanar waveguide electrically connected to the first coax-like electrical connection; and
an electrical redistribution layer arranged over the main surface of the semiconductor chip and configured to provide a second coax-like electrical connection between the electrical contact of the semiconductor chip and the external connection element, wherein the second coax-like electrical connection comprises a section extending in a direction parallel to the main surface of the semiconductor chip.