US 11,837,553 B2
Semiconductor package
Junghoon Kang, Anyang-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 18, 2021, as Appl. No. 17/405,696.
Claims priority of application No. 10-2020-0159234 (KR), filed on Nov. 24, 2020.
Prior Publication US 2022/0165634 A1, May 26, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 23/544 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/544 (2013.01) [H01L 23/3121 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06517 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a first semiconductor chip;
an encapsulant covering at least a portion of the first semiconductor chip;
insulating layers provided on the encapsulant, each of the insulating layers being transparent or translucent; and
wiring layers provided on the encapsulant, the wiring layers being partially covered by the insulating layers,
wherein an outermost insulating layer of the insulating layers comprises a first region and a second region,
wherein a color of the first region is different from a color of the second region,
wherein the second region surrounds the first region, and
wherein at least one marking pattern comprising at least one step portion is provided in the first region of the outermost insulating layer.