US 11,837,540 B2
Surface-mount thin-film fuse having compliant terminals
Dan Rozbroj, Modra (CZ); Yehuda Seidman, Jerusalem (IL); and Elinor O'Neill, Jerusalem (IL)
Assigned to KYOCERA AVX Components Corporation, Fountain Inn, SC (US)
Filed by KYOCERA AVX Components Corporation, Fountain Inn, SC (US)
Filed on Jul. 18, 2022, as Appl. No. 17/866,780.
Application 17/866,780 is a continuation of application No. 16/850,160, filed on Apr. 16, 2020, granted, now 11,404,372.
Claims priority of provisional application 62/841,917, filed on May 2, 2019.
Prior Publication US 2022/0359389 A1, Nov. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01H 85/041 (2006.01); H01L 23/525 (2006.01)
CPC H01L 23/5256 (2013.01) [H01H 85/0411 (2013.01); H01H 2085/0414 (2013.01)] 16 Claims
OG exemplary drawing
 
13. A method for forming a surface-mountable thin-film fuse component, the method comprising:
providing a substrate having a top surface, a first end and a second end that is spaced apart from the
depositing a fuse layer formed over the top surface of the substrate, the fuse layer comprising a thin-film fuse track; and
forming an external terminal along the first end of the substrate and connected with the fuse layer, the external terminal comprising a first layer formed over the first end of the substrate and in electrical contact with the fuse layer, the external terminal further comprising a compliant layer formed over the first layer, the compliant layer comprising a conductive polymeric composition, wherein the compliant layer has a Young's modulus that is less than about 20 GPa and a volume resistivity that is less than about 0.01 ohm-cm.