US 11,837,517 B2
Packaged semiconductor devices with wireless charging means
Chen-Hua Yu, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); Tzu-Sung Huang, Tainan (TW); Ming-Hung Tseng, Toufen Township (TW); and Hung-Yi Kuo, Taipei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 10, 2022, as Appl. No. 17/668,648.
Application 17/668,648 is a continuation of application No. 16/867,753, filed on May 6, 2020, granted, now 11,251,644.
Application 16/867,753 is a continuation of application No. 16/132,688, filed on Sep. 17, 2018, granted, now 10,651,675, issued on May 12, 2020.
Application 16/132,688 is a continuation of application No. 15/254,135, filed on Sep. 1, 2016, granted, now 10,097,030, issued on Oct. 9, 2018.
Claims priority of provisional application 62/329,224, filed on Apr. 29, 2016.
Prior Publication US 2022/0166254 A1, May 26, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/3205 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 23/10 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H02J 7/00 (2006.01); H02J 50/10 (2016.01); H04B 5/00 (2006.01); H01F 38/14 (2006.01); H01F 27/36 (2006.01)
CPC H01L 23/3121 (2013.01) [H01F 27/36 (2013.01); H01F 27/363 (2020.08); H01F 38/14 (2013.01); H01L 21/32051 (2013.01); H01L 23/10 (2013.01); H01L 23/49822 (2013.01); H01L 23/5227 (2013.01); H01L 23/5389 (2013.01); H01L 23/645 (2013.01); H02J 7/0042 (2013.01); H02J 50/10 (2016.02); H04B 5/0037 (2013.01); H04B 5/0075 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/19 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a semiconductor device;
a molding material surrounding the semiconductor device; and
a conductive slot positioned over the molding material and having an opening and at least two channels connecting the opening to the edges of the conductive slot, and at least two of the channels extend in different directions, wherein the conductive slot is divided by the channels as a plurality of sub-portions, and one of the sub-portions has a first edge, a second edge, and a third edge that extend in different directions.