US 11,837,494 B2
Substrate handling device with adjustable joints
KiHyun Kim, Chandler, AZ (US); Sam Kim, Chandler, AZ (US); and Rutvij Naik, Tempe, AZ (US)
Assigned to ASM IP Holding B.V., Almere (NL)
Filed by ASM IP Holding B.V., Almere (NL)
Filed on Oct. 7, 2022, as Appl. No. 17/961,882.
Application 17/961,882 is a continuation of application No. 17/189,787, filed on Mar. 2, 2021, granted, now 11,488,854.
Claims priority of provisional application 62/988,217, filed on Mar. 11, 2020.
Prior Publication US 2023/0034114 A1, Feb. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/677 (2006.01); H01L 21/687 (2006.01); B65G 47/90 (2006.01)
CPC H01L 21/68707 (2013.01) [B65G 47/90 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A substrate handling device, comprising:
an adjustable joint comprising a first body and a second body, wherein the first body and the second body are rigidly connectable at a selected contact angle to adjust a pitch of the second body,
wherein the first body comprises an adjustment surface and the second body comprises a contact surface, wherein the adjustment surface is disposed against the contact surface when the first body and the second body are rigidly connected, and wherein the adjustment surface is unitary and comprises first and second planar surfaces that are abutting, with the first planar surface being angled away from the second planar surface, whereby the first and second planar surfaces are non-planar,
wherein the first body further comprises:
at least a first adjustment aperture extending through the first planar surface, the first adjustment aperture being internally threaded; and
a first set screw disposed in the first adjustment aperture, and
wherein the first set screw is configured for advancement and retraction through the first adjustment aperture to selectively dispose a tip of the first set screw above or below the first planar surface and in contact with the contact surface to achieve a desired pitch of the second body.