US 11,837,488 B2
Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body
Asumi Nagai, Nagoya (JP); Katsuhiro Inoue, Nagoya (JP); and Yuji Katsuda, Nagoya (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK INSULATORS, LTD., Nagoya (JP)
Filed on Jul. 21, 2020, as Appl. No. 16/934,222.
Application 16/934,222 is a continuation of application No. PCT/JP2019/005853, filed on Feb. 18, 2019.
Claims priority of application No. PCT/JP2018/005952 (WO), filed on Feb. 20, 2018.
Prior Publication US 2020/0350196 A1, Nov. 5, 2020
Int. Cl. H01T 23/00 (2006.01); H01L 21/683 (2006.01); B28B 1/00 (2006.01); C04B 35/117 (2006.01); C04B 35/565 (2006.01)
CPC H01L 21/6833 (2013.01) [B28B 1/001 (2013.01); C04B 35/117 (2013.01); C04B 35/565 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A composite sintered body, comprising:
aluminum oxide;
silicon carbide; and
magnesium-aluminum composite oxide having a spinel-type crystal structure,
wherein said silicon carbide includes β-type silicon carbide,
as to the particle diameter of said silicon carbide, D50 is not smaller than 0.7 μm, and
the ratio of carbon in said silicon carbide to said composite sintered body is not lower than 1.0 weight percentage and not higher than 4.0 weight percentage.