US 11,837,487 B2
Transfer device, substrate processing system, transfer method and substrate processing method
Takeshi Tamura, Koshi (JP); Masatoshi Kaneda, Koshi (JP); and Seiji Nakano, Koshi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 16/630,063
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Jun. 29, 2018, PCT No. PCT/JP2018/024927
§ 371(c)(1), (2) Date Jan. 10, 2020,
PCT Pub. No. WO2019/013022, PCT Pub. Date Jan. 17, 2019.
Claims priority of application No. 2017-136322 (JP), filed on Jul. 12, 2017; and application No. 2018-007669 (JP), filed on Jan. 19, 2018.
Prior Publication US 2020/0234990 A1, Jul. 23, 2020
Int. Cl. H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/67742 (2013.01) [H01L 21/67092 (2013.01); H01L 21/67766 (2013.01); H01L 21/68 (2013.01); H01L 21/6838 (2013.01); H01L 21/78 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A transfer device, comprising:
a grip member configured to hold a frame to which the substrate is mounted with a tape therebetween;
a guide member configured to place thereon the frame held by the grip member;
a moving mechanism configured to move the grip member with respect to the guide member to move the frame held by the grip member along the guide member,
a grip holder comprising the grip member and the guide member; and
an attracting/holding unit configured to attract and hold the substrate,
wherein the attracting/holding unit comprises:
an arm configured to be moved in multiple directions;
an intermediate disk connected to a bottom portion of the arm;
a porous pad connected to a bottom portion of the intermediate disk;
alignment pins protruded downwards from the intermediate disk;
a first suspension mechanism provided between the arm and the intermediate disk and configured to allow the intermediate disk to be suspended from the arm by an elastic member; and
a second suspension mechanism configured to connect the arm and the porous pad, and
wherein the alignment pins are protruded downwards below an attracting surface of a bottom surface of the porous pad when the alignment pins are in a no-load state.