CPC H01L 21/0415 (2013.01) [H01L 21/0237 (2013.01); H01L 21/0262 (2013.01); H01L 21/02085 (2013.01); H01L 21/02381 (2013.01); H01L 21/02444 (2013.01); H01L 21/02488 (2013.01); H01L 21/02527 (2013.01); H01L 21/02576 (2013.01); H01L 21/043 (2013.01); H01L 21/3065 (2013.01); H01L 29/06 (2013.01); H01L 29/1602 (2013.01); H01L 29/6603 (2013.01); H01L 29/66045 (2013.01); H01L 29/78 (2013.01); H01L 29/868 (2013.01); H01L 31/028 (2013.01); H01L 33/34 (2013.01); H01L 21/02573 (2013.01); H01L 29/1606 (2013.01); H01L 29/7781 (2013.01); H01L 33/005 (2013.01); Y02E 10/547 (2013.01)] | 19 Claims |
1. A method of fabricating diamond films, the method including the steps of:
seeding a surface of silicon dioxide substrate material;
depositing a low temperature diamond layer upon the surface of the substrate material; and
modifying the low temperature diamond layer by including non-carbon atoms to create at least two layers having differing substitutional atoms.
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