US 11,837,448 B2
High-temperature chamber and chamber component cleaning and maintenance method and apparatus
Shuran Sheng, Saratoga, CA (US); Lin Zhang, San Jose, CA (US); Jiyong Huang, Rockwall, TX (US); Jang Seok Oh, San Ramon, CA (US); Joseph C. Werner, Santa Clara, CA (US); Nitin Khurana, Santa Clara, CA (US); Ganesh Balasubramanian, Fremont, CA (US); Jennifer Y. Sun, Mountain View, CA (US); Xinhai Han, Santa Clara, CA (US); and Zhijun Jiang, Sunnyvale, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Apr. 27, 2021, as Appl. No. 17/242,059.
Prior Publication US 2022/0344135 A1, Oct. 27, 2022
Int. Cl. H01J 37/32 (2006.01); C23C 16/44 (2006.01); B08B 7/00 (2006.01)
CPC H01J 37/32862 (2013.01) [B08B 7/0035 (2013.01); C23C 16/4405 (2013.01); H01J 37/32449 (2013.01); H01J 37/32724 (2013.01); H01J 2237/335 (2013.01); H01J 2237/3321 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method, comprising:
(a) cleaning a surface of a substrate support having a bulk layer disposed thereon, the substrate support disposed in a processing environment configured to process substrates, wherein cleaning includes forming a plasma at a high temperature from a cleaning gas mixture, the cleaning gas mixture comprising a fluorine containing gas and oxygen;
(b) removing oxygen radicals from the processing environment at the high temperature with a treatment plasma formed from a treatment gas mixture, the treatment gas mixture comprising the fluorine containing gas; and
(c) repairing an interface of the substrate support and the bulk layer at the high temperature with a post-treatment plasma, the post-treatment plasma formed from a post-treatment gas mixture including a nitrogen containing gas, wherein the high temperature is greater than or equal to about 500 degrees Celsius.