| CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01)] | 16 Claims |
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1. A ceramic electronic component comprising:
a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion, the internal electrodes being exposed through side surfaces of the body; and
external electrodes including electrode layers respectively disposed on the side surfaces of the body and conductive resin layers respectively disposed on the electrode layers, the electrode layers being connected to the plurality of internal electrodes, wherein ta2/ta1 is 0.05 or greater and less than 0.5,
where ta1 is a thickness of each of the electrode layers at a central portion of the capacitance formation portion and ta2 is a thickness of each of the electrode layers at a boundary between the capacitance formation portion and the protective portion,
wherein each of the electrode layers extends at least onto the upper and lower surfaces of the body and comprises conductive metal and glass, and
wherein each of the electrode layers includes a convex portion disposed on the capacitance formation portion.
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