US 11,837,404 B2
Electronic component
Sang Yeop Kim, Suwon-si (KR); Beom Joon Cho, Suwon-si (KR); and Gyeong Ju Song, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 18, 2023, as Appl. No. 18/098,280.
Application 18/098,280 is a continuation of application No. 17/469,164, filed on Sep. 8, 2021, granted, now 11,587,729.
Claims priority of application No. 10-2020-0168125 (KR), filed on Dec. 4, 2020.
Prior Publication US 2023/0154677 A1, May 18, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 2/06 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01)
CPC H01G 2/06 (2013.01) [H01G 4/2325 (2013.01); H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a multilayer capacitor including a body and an external electrode disposed externally on the body;
a metal frame coupled to the multilayer capacitor; and
an adhesive portion disposed between the external electrode and the metal frame and comprising a solder portion including a solder and a conductive resin portion including a conductive substance and a resin,
wherein the body includes a dielectric layer and internal electrodes stacked with the dielectric layer interposed therebetween, and the internal electrodes are connected with the external electrode.