US 11,835,816 B2
Circuit board for light-emitting diode assembly, backlight unit including the same and image display device including the same
Cheol Hun Lee, Gyeonggi-do (KR); Do Hyoung Kwon, Gyeonggi-do (KR); and Sung Jin Noh, Gyeonggi-do (KR)
Assigned to DONGWOO FINE-CHEM CO., LTD., Jeollabuk-Do (KR)
Filed by DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do (KR)
Filed on Aug. 9, 2022, as Appl. No. 17/883,753.
Claims priority of application No. 10-2021-0104331 (KR), filed on Aug. 9, 2021.
Prior Publication US 2023/0044317 A1, Feb. 9, 2023
Int. Cl. G02F 1/13357 (2006.01); G02F 1/1335 (2006.01)
CPC G02F 1/133603 (2013.01) [G02F 1/133612 (2021.01)] 18 Claims
OG exemplary drawing
 
1. A circuit board for a light-emitting diode assembly, comprising:
a substrate layer;
a dimming zone column disposed on one surface of the substrate layer, the dimming zone column comprising dimming zones, each of the dimming zones comprising a predetermined number of LED landing pads, wherein the dimming zones comprise a predetermined number of first dimming zones included in an upper portion of the dimming zone column in a plan view and a predetermined number of second dimming zones included in a lower portion of the dimming zone column in the plan view;
a first common wiring commonly connected to the first dimming zones and disposed at a first lateral side in a row direction of the dimming zone column;
a second common wiring connected to the second dimming zones and disposed at a second lateral side in the row direction opposite to the first lateral side of the dimming zone column; and
an individual wiring connected to each of the dimming zones,
wherein the LED landing pads, the first common wiring, the second common wiring and the individual wiring are all disposed in a single-layered conductive layer.