US 11,835,758 B2
Packaging for microLEDs for chip to chip communication
Bardia Pezeshki, Sunnyvale, CA (US); Robert Kalman, Sunnyvale, CA (US); and Alex Tselikov, Sunnyvale, CA (US)
Assigned to AvicenaTech Corp., Mountain View, CA (US)
Filed by AvicenaTech Corp., Mountain View, CA (US)
Filed on Nov. 28, 2022, as Appl. No. 17/994,784.
Application 17/994,784 is a continuation of application No. 17/145,110, filed on Jan. 8, 2021, granted, now 11,513,285.
Claims priority of provisional application 62/960,546, filed on Jan. 13, 2020.
Claims priority of provisional application 62/958,619, filed on Jan. 8, 2020.
Prior Publication US 2023/0176281 A1, Jun. 8, 2023
Int. Cl. G02B 6/12 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/12004 (2013.01) [H01L 25/167 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A chip-to-chip optical interconnect including a microLED, comprising:
a first semiconductor chip electrically coupled to an interposer;
a second semiconductor chip electrically coupled to the interposer;
a third semiconductor chip electrically coupled to the interposer;
a first microLED;
first circuitry, electrically coupled to the first semiconductor chip, for driving the first microLED based on data from the first semiconductor chip;
a first encapsulant substantially encapsulating the first microLED;
a first photodetector;
first amplification circuitry for amplifying signals from the first photodetector, the first amplification circuitry electrically coupled to provide electrical signals to the second semiconductor chip;
a first waveguide optically coupling the first microLED and the first photodetector, the encapsulated first microLED disposed within material of the first waveguide
a second microLED;
a second encapsulant substantially encapsulating the second microLED;
second circuitry electrically coupled to the second semiconductor chip, for driving the second microLED based on data from the second semiconductor chip;
a second photodetector;
second amplification circuitry for amplifying signals from the second photodetector, the second amplification circuitry electrically coupled to provide electrical signals to the third semiconductor chip; and
a second waveguide optically coupling the second microLED and the second photodetector, the encapsulated second microLED disposed within material of the second waveguide.