US 11,835,549 B2
Thermal array with gimbal features and enhanced thermal performance
Gregory Cruzan, San Jose, CA (US); Karthik Ranganathan, San Jose, CA (US); Gilberto Oseguera, San Jose, CA (US); Joe Koeth, San Jose, CA (US); Paul Ferrari, San Jose, CA (US); James Hastings, San Jose, CA (US); and Chee Wah Ho, San Jose, CA (US)
Assigned to Advantest Test Solutions, Inc., San Jose, CA (US)
Filed by Advantest Test Solutions, Inc., San Jose, CA (US)
Filed on Jan. 26, 2022, as Appl. No. 17/585,228.
Prior Publication US 2023/0236241 A1, Jul. 27, 2023
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2877 (2013.01) [G01R 31/2863 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A test system for testing a device under test (DUT), the test system comprising:
a test interface board (TIB);
a socket interface board (SIB) comprising:
a gimbaling mount that fixes the SIB to the TIB and allows the SIB to pivot freely in three dimensions; and
a socket configured to receive the DUT;
a superstructure that surrounds the socket; and
a thermal array,
wherein the DUT is disposed in the socket, and wherein under pressure the gimbaling mount allows a top surface of the superstructure to evenly and securely contact a bottom surface of the thermal array substantially without air gaps between the top surface of the superstructure and the bottom surface of the thermal array to regulate a temperature of the DUT during testing.