US 11,835,334 B2
Shape measuring method, shape measuring device, and program
Kazuki Hagihara, Yokohama Kanagawa (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by KIOXIA CORPORATION, Tokyo (JP)
Filed on Feb. 28, 2022, as Appl. No. 17/683,182.
Claims priority of application No. 2021-115748 (JP), filed on Jul. 13, 2021.
Prior Publication US 2023/0015673 A1, Jan. 19, 2023
Int. Cl. G01B 15/04 (2006.01); G01N 23/2251 (2018.01)
CPC G01B 15/04 (2013.01) [G01N 23/2251 (2013.01); G01N 2223/418 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A shape measuring method, comprising:
acquiring a scattering intensity profile from a substrate for a first electromagnetic wave from a first device, the substrate having a pattern on a first surface;
acquiring, by a first simulation, a first expected scattering intensity profile for a first virtual structure corresponding to a first parameter group of first parameters including an attention parameter;
calculating a first convergence value for each of the first parameters in a first fitting process based on the scattering intensity profile and the first expected scattering intensity profile;
acquiring, by a second simulation, a second expected scattering intensity profile for a second virtual structure corresponding to a second parameter group of second parameters including the attention parameter set to a constant value equal to the first convergence value; and
calculating a second convergence value for each of the second parameters in a second fitting process based on the scattering intensity profile and the second expected scattering intensity profile.