US 11,834,744 B2
Ceramic showerheads with conductive electrodes
Laksheswar Kalita, San Jose, CA (US); Soonam Park, Sunnyvale, CA (US); Dmitry Lubomirsky, Cupertino, CA (US); Tien Fak Tan, Campbell, CA (US); LokKee Loh, San Francisco, CA (US); Saravjeet Singh, Sunnyvale, CA (US); and Tae Won Kim, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 23, 2023, as Appl. No. 18/173,704.
Application 17/176,411 is a division of application No. 16/245,698, filed on Jan. 11, 2019, granted, now 10,920,319.
Application 18/173,704 is a continuation of application No. 17/176,411, filed on Feb. 16, 2021, granted, now 11,591,693.
Prior Publication US 2023/0203657 A1, Jun. 29, 2023
Int. Cl. H01J 37/32 (2006.01); C23C 16/455 (2006.01); C23C 16/34 (2006.01); H01L 21/3213 (2006.01); H01L 21/285 (2006.01); C23C 16/458 (2006.01)
CPC C23C 16/45565 (2013.01) [C23C 16/34 (2013.01); C23C 16/4581 (2013.01); C23C 16/45574 (2013.01); H01J 37/32495 (2013.01); H01J 37/32559 (2013.01); H01L 21/28512 (2013.01); H01L 21/3213 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of fabricating a showerhead for a semiconductor processing system, the method comprising: applying a electrically conductive material to a first surface of a dielectric plate, with the electrically conductive material being maintained a first radial distance away from each of a plurality of aperture locations of the dielectric plate; masking the plurality of aperture locations at a second radial distance away from each of the plurality of aperture locations; and applying a dielectric coating to an exposed portion of the electrically conductive material after masking the plurality of aperture locations.