US 11,834,415 B2
Adhesive composition for semiconductor circuit connection and adhesive film including the same
Ju Hyeon Kim, Daejeon (KR); Junghak Kim, Daejeon (KR); Seunghee Nam, Daejeon (KR); and Kwang Joo Lee, Daejeon (KR)
Assigned to LG CHEM, LTD., Seoul (KR)
Appl. No. 16/769,786
Filed by LG CHEM, LTD., Seoul (KR)
PCT Filed Apr. 17, 2019, PCT No. PCT/KR2019/004651
§ 371(c)(1), (2) Date Jun. 4, 2020,
PCT Pub. No. WO2019/203572, PCT Pub. Date Oct. 24, 2019.
Claims priority of application No. 10-2018-0044654 (KR), filed on Apr. 17, 2018; and application No. 10-2019-0043931 (KR), filed on Apr. 15, 2019.
Prior Publication US 2020/0308121 A1, Oct. 1, 2020
Int. Cl. C07D 233/58 (2006.01); C08J 5/18 (2006.01); C09J 133/08 (2006.01); C09J 163/00 (2006.01); C09J 171/12 (2006.01); H01L 23/00 (2006.01)
CPC C07D 233/58 (2013.01) [C08J 5/18 (2013.01); C09J 133/08 (2013.01); C09J 163/00 (2013.01); C09J 171/12 (2013.01); H01L 24/29 (2013.01); C08J 2333/08 (2013.01); C08J 2363/00 (2013.01); C08J 2371/12 (2013.01); C08J 2433/08 (2013.01); C08J 2463/00 (2013.01); C08J 2471/12 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/066 (2013.01); H01L 2924/0665 (2013.01)] 14 Claims
 
1. An adhesive resin composition for bonding semiconductors, comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound represented by Chemical Formula 1 or 2-(4,5-Dihydro-1H-imidazol-2-yl)phenol:

OG Complex Work Unit Chemistry
wherein in the Chemical Formula 1,
R1 is hydrogen, a C1 to C10 alkyl group, or a C6 to C20 aryl group,
R2 is a carboxyl group, a carbonyl group, a formyl group, or an amine group,
R3 is hydrogen, a halogen, a C1 to C10 alkyl group, or a C6 to C20 aryl group, and
n is 1 to 4.