US 11,833,718 B2
Mold-releasable surfacing materials for composite parts
Junjie Jeffrey Sang, Newark, DE (US); and Dalip Kumar Kohli, Churchville, MD (US)
Assigned to CYTEC INDUSTRIES INC., Princeton, NJ (US)
Filed by CYTEC INDUSTRIES INC., Princeton, NJ (US)
Filed on Dec. 28, 2020, as Appl. No. 17/135,135.
Application 17/135,135 is a continuation of application No. 16/065,160, granted, now 10,906,211, previously published as PCT/US2016/068014, filed on Dec. 21, 2016.
Claims priority of provisional application 62/270,808, filed on Dec. 22, 2015.
Prior Publication US 2021/0122088 A1, Apr. 29, 2021
Int. Cl. B29C 33/56 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/02 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 27/38 (2006.01); B32B 27/18 (2006.01); B32B 15/08 (2006.01); B32B 5/22 (2006.01); B32B 5/24 (2006.01); B29C 70/08 (2006.01)
CPC B29C 33/56 (2013.01) [B32B 5/024 (2013.01); B32B 5/22 (2013.01); B32B 5/24 (2013.01); B32B 5/26 (2013.01); B32B 15/02 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 27/283 (2013.01); B32B 27/304 (2013.01); B32B 27/34 (2013.01); B32B 27/38 (2013.01); B29C 70/088 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2255/02 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/101 (2013.01); B32B 2264/02 (2013.01); B32B 2264/102 (2013.01); B32B 2264/105 (2013.01); B32B 2264/108 (2013.01); B32B 2307/202 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/71 (2013.01); B32B 2307/748 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A surfacing material that is mold-releasable and electrically conductive, comprising:
(a) a woven fabric that is in direct contact with and bonded on one side to a curable epoxy-thermoplastic layer;
(b) a curable resin layer in direct contact with and bonded to the opposite side of the woven fabric, said resin layer comprising one or more thermoset resins and a curing agent; and
(c) a conductive layer laminated to or embedded in the curable resin layer, wherein the curable epoxy-thermoplastic layer comprises:
(i) polyvinyl formal;
(ii) at least one epoxy resin;
(iii) a curing agent and/or a catalyst for the epoxy resin; and
(iv) a polyol.