US 11,833,621 B2
Flux and solder material
Kazuhiro Yukikata, Tokyo (JP); and Noriyoshi Uchida, Tokyo (JP)
Assigned to KOKI COMPANY LIMITED, Tokyo (JP)
Appl. No. 17/052,318
Filed by KOKI COMPANY LIMITED, Tokyo (JP)
PCT Filed Apr. 27, 2019, PCT No. PCT/JP2019/018170
§ 371(c)(1), (2) Date Nov. 2, 2020,
PCT Pub. No. WO2019/216291, PCT Pub. Date Nov. 14, 2019.
Claims priority of application No. 2018-090218 (JP), filed on May 8, 2018.
Prior Publication US 2021/0086317 A1, Mar. 25, 2021
Prior Publication US 2023/0103270 A2, Mar. 30, 2023
Int. Cl. B23K 35/362 (2006.01); B23K 35/36 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); B22F 1/10 (2022.01)
CPC B23K 35/3616 (2013.01) [B22F 1/10 (2022.01); B23K 35/262 (2013.01); B23K 35/362 (2013.01); B23K 35/3612 (2013.01); C22C 13/00 (2013.01)] 14 Claims
 
1. A flux for solder paste comprising:
an iodine-containing cyclic compound selected from the group consisting of 1-iodonaphthalene, 2-bromo-5-iodo-3-methylpyridine, 5,7-diiodo-8-hydroxyquinoline, 2,4,5-triiodo-1h-imidazole, and 1,3-diiodo-5,5-dimethylhydantoin, wherein
the flux contains the iodine-containing cyclic compound in an amount of from 0.1% by mass to 5.0% by mass.