US 11,833,608 B2
Laser processing method
Naotoshi Kirihara, Tokyo (JP); and Takamasa Kaneko, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Mar. 4, 2022, as Appl. No. 17/653,564.
Claims priority of application No. 2021-037797 (JP), filed on Mar. 9, 2021.
Prior Publication US 2022/0288719 A1, Sep. 15, 2022
Int. Cl. B23K 26/0622 (2014.01); B23K 26/40 (2014.01); B23K 26/352 (2014.01); B23K 26/364 (2014.01); B23K 101/40 (2006.01)
CPC B23K 26/0622 (2015.10) [B23K 26/352 (2015.10); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B23K 2101/40 (2018.08)] 2 Claims
OG exemplary drawing
 
1. A laser processing method for performing laser processing on a wafer having organic films on a substrate, the laser processing method comprising:
a blackening step of emitting a pulsed laser beam of a wavelength transparent to the organic films from a laser oscillator and blackening the organic films by irradiating the organic films with the pulsed laser beam of energy equal to or higher than a processing threshold value at which the organic films are processed such that an overlap ratio of the pulsed laser beam successively applied to the organic films is equal to or more than 90% and less than 100%; and
a groove processing step of forming a laser-processed groove by irradiating the blackened organic films with the pulsed laser beam and making the blackened organic films absorb the pulsed laser beam, after performing the blackening step.