US 12,490,656 B2
Hybrid structure and a method for manufacturing the same
Didier Landru, Le Champ-près-Froges (FR)
Assigned to Soitec, Bernin (FR)
Filed by Soitec, Bernin (FR)
Filed on Jan. 3, 2024, as Appl. No. 18/403,485.
Application 18/403,485 is a continuation of application No. 17/663,569, filed on May 16, 2022, granted, now 11,930,710.
Application 17/663,569 is a continuation of application No. 15/769,690, granted, now 11,349,065, issued on May 31, 2022, previously published as PCT/FR2016/052674, filed on Oct. 17, 2016.
Claims priority of application No. 1559993 (FR), filed on Oct. 20, 2015.
Prior Publication US 2024/0147864 A1, May 2, 2024
Int. Cl. H10N 30/073 (2023.01); H03H 9/02 (2006.01); H10N 30/00 (2023.01); H10N 30/50 (2023.01); H10N 30/88 (2023.01)
CPC H10N 30/073 (2023.02) [H03H 9/02574 (2013.01); H10N 30/508 (2023.02); H10N 30/706 (2024.05); H10N 30/88 (2023.02)] 15 Claims
OG exemplary drawing
 
1. A hybrid structure, comprising:
a support substrate having a first coefficient of thermal expansion and a support thickness; and
an effective layer disposed on and molecularly bonded to the support substrate along a bonding interface having a bonding energy greater than or equal to 1000 mJ/m2, the effective layer having an effective thickness, the effective layer having a second coefficient of thermal expansion greater than the first coefficient of thermal expansion of the support substrate;
wherein one or more non-bonded areas are present at the bonding interface between the effective layer and the support substrate, and the effective thickness is less than a threshold thickness at which buckling of the effective layer occurs upon annealing of the hybrid structure at a temperature of 400° C.±200° C.