| CPC H10K 59/40 (2023.02) [G06F 3/0446 (2019.05); H10K 59/1201 (2023.02); H10K 59/131 (2023.02)] | 20 Claims |

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8. A method of manufacturing a display device, the method comprising:
forming an encapsulation layer on a display panel;
forming a first conductive pattern on the encapsulation layer;
forming a touch insulating layer covering at least a portion of the first conductive pattern; and
forming a second conductive pattern on the touch insulating layer,
wherein the second conductive pattern comprises a first metal layer and a second metal layer,
wherein the first metal layer comprises a plurality of sub-metal layers, the plurality of sub-metal layers of the first metal layer comprising a first sub-metal layer,
wherein the second metal layer comprises a plurality of sub-metal layers, the plurality of sub-metal layers of the second metal layer comprising a first sub-metal layer,
wherein the second conductive pattern comprises a multi-layer structure in which the plurality of sub-metal layers of the first metal layer and the plurality of sub-metal layers of the second metal layer are alternately arranged,
wherein the first sub-metal layer of the first metal layer is stacked on the first sub-metal layer of the second metal layer, and
wherein a width of the first sub-metal layer of the first metal layer is wider than a width of the first sub-metal layer of the second metal layer.
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