US 12,490,467 B2
Transistor and semiconductor device with multiple threshold voltages and fabrication method thereof
Shen-Yang Lee, Miaoli County (TW); Hsiang-Pi Chang, New Taipei (TW); and Huang-Lin Chao, Hillsboro, OR (US)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 9, 2023, as Appl. No. 18/151,481.
Claims priority of provisional application 63/407,732, filed on Sep. 19, 2022.
Prior Publication US 2024/0096993 A1, Mar. 21, 2024
Int. Cl. H10D 30/67 (2025.01); H10D 64/01 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01)
CPC H10D 30/6735 (2025.01) [H10D 30/6757 (2025.01); H10D 64/017 (2025.01); H10D 84/0128 (2025.01); H10D 84/013 (2025.01); H10D 84/0158 (2025.01); H10D 84/038 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A method for tuning a threshold voltage of a transistor, comprising:
forming a channel layer over a substrate;
forming an interfacial layer over and surrounding the channel layer;
forming a gate dielectric layer over and surrounding the interfacial layer;
forming a dipole layer over and wrapping around the gate dielectric layer by performing a cyclic deposition etch process, wherein the dipole layer comprises dipole metal elements and has a substantially uniform thickness;
performing a thermal drive-in process to drive the dipole metal elements in the dipole layer into the gate dielectric layer to form an interfacial dipole surface; and
removing the dipole layer.