US 12,490,413 B2
Packaged device, packaged module, and power conversion device
Dong Chen, Shanghai (CN); Fenglong Lu, Shanghai (CN); Yunyu Tang, Shanghai (CN); Lei Shi, Shanghai (CN); Yunfeng Liu, Shanghai (CN); Shuyi Lv, Shanghai (CN); and Pengcheng Zhang, Shanghai (CN)
Assigned to HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed on Sep. 15, 2023, as Appl. No. 18/468,174.
Claims priority of application No. 202211132264.3 (CN), filed on Sep. 16, 2022; and application No. 202310562515.X (CN), filed on May 18, 2023.
Prior Publication US 2024/0096729 A1, Mar. 21, 2024
Int. Cl. H05K 7/20 (2006.01); H01L 23/373 (2006.01); H01L 23/427 (2006.01); H05K 1/02 (2006.01); H01L 23/31 (2006.01)
CPC H05K 7/205 (2013.01) [H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/427 (2013.01); H01L 23/4275 (2013.01); H05K 1/0204 (2013.01); H05K 7/209 (2013.01); H01L 23/3121 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A packaged device comprising:
a circuit board comprising:
at least one electrically conducting layer having a first specific heat capacity,
an insulating ceramic substrate having a second specific heat capacity,
a first circuit board surface and a second circuit board surface disposed opposite to each other, and
an accommodating space that runs through the first circuit board surface and the second circuit board surface to form a through hole portion of the circuit board;
an electronic component located on the first circuit board surface and electrically coupled to the at least one electrically conductor layer of the circuit board; and
a heat storage portion embedded in the accommodating space, ends of the heat storage portion being substantially coplanar with the first circuit board surface and the second circuit board surface, respectively, the heat storage portion disposed adjacent to the electronic component, and the heat storage portion comprises a phase-change material,
wherein a phase of the phase-change material of the heat storage portion has a third specific heat capacity that is higher than the second specific heat capacity of the insulating ceramic substrate and the first specific heat capacity of each of the at least one electrically conducting layer, and
wherein the heat storage portion is configured to store heat and release the heat.