US 12,490,410 B2
Circuit devices integrated with boiling enhancement for two-phase immersion cooling
David Shia, Portland, OR (US); Jin Yang, Hillsboro, OR (US); Jimmy Chuang, Taipei (TW); Mohanraj Prabjugoud, Hillsboro, OR (US); and Michael T. Crocker, Hillsboro, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 6, 2021, as Appl. No. 17/542,907.
Prior Publication US 2023/0180434 A1, Jun. 8, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/203 (2013.01) [H05K 7/20381 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
an integrated circuit device comprising a first surface to couple with a plurality of interconnects, and a second surface opposite the first surface;
an integrated heat spreader of a single material, the integrated heat spreader comprising:
a main body over the second surface of the integrated circuit device and extending beyond an edge of the integrated circuit device, the main body having a first surface facing the second surface of the integrated circuit device; and
a sidewall adjacent the edge of the integrated circuit device; and
a plurality of substantially cylindrical projections, opposite the first surface of the integrated heat spreader, wherein each of the projections includes at least one sidewall, which further includes a plurality of surface area enhancement structures that are to nucleate vapor bubbles within a dielectric liquid.