US 12,490,376 B2
Component carrier with asymmetric build-up and methods for determining a design of and manufacturing the same
Diego Lorenzoni, Novara (IT); Mikael Andreas Tuominen, Pernio (FI); and Seok Kim Tay, Singapore (SG)
Assigned to AT&S (China) Co. Ltd., Shanghai (CN)
Filed by AT&S (China) Co. Ltd., Shanghai (CN)
Filed on Jan. 4, 2023, as Appl. No. 18/150,188.
Claims priority of application No. 202210006528.4 (CN), filed on Jan. 5, 2022.
Prior Publication US 2023/0217589 A1, Jul. 6, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 1/03 (2006.01)
CPC H05K 1/0298 (2013.01) [H05K 1/188 (2013.01); H05K 3/4038 (2013.01); H05K 3/421 (2013.01); H05K 1/0306 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0355 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A component carrier with an asymmetric build-up, the component carrier comprising:
a core;
a first stack at a first main surface of the core, the first stack comprising at least one first electrically conductive layer structure and a plurality of first electrically insulating layer structures; and
a second stack at a second main surface of the core, the second stack comprising at least one second electrically conductive layer structure and a plurality of second electrically insulating layer structures;
wherein at least two of the second electrically insulating layer structures are in direct contact with each other and each one of these at least two second electrically insulating layer structures has a smaller thickness than and/or comprises a different material property than at least one of the first electrically insulating layer structures;
wherein the first electrically insulating layer structures and the second electrically insulating layer structures extend over an entire dimension of the main surfaces;
wherein at least one of the at least two of the second electrically insulating layer structures are free of a direct contact to an electrically conductive trace and/or pad;
wherein the first main surface of the core is covered by one of the at least one first electrically conductive layer structure and the second main surface of the core is covered by one of the at least one second electrically conductive layer structure;
wherein each one of the first stack and the second stack comprise a laminated layer sequence;
wherein a material of the first insulating layer structures and a material of the second insulating layer structures is the same.