US 12,489,479 B2
Power combining for high power amplifiers
John Bucceri, Londonderry, NH (US); Bernard J. Schmanski, Merrimack, NH (US); Douglas M. Dugas, Chelmsford, NH (US); Patrick D. McKivergan, Londonderry, NH (US); and Michael Patrick Doran, Nashua, NH (US)
Assigned to BAE Systems Information and Electronic Systems Integration Inc., Nashua, NH (US)
Filed by BAE Systems Information and Electronic Systems Integration Inc., Nashua, NH (US)
Filed on Jul. 27, 2023, as Appl. No. 18/360,409.
Prior Publication US 2025/0038779 A1, Jan. 30, 2025
Int. Cl. H04B 1/38 (2015.01); H04B 1/04 (2006.01); H04B 1/10 (2006.01)
CPC H04B 1/1009 (2013.01) [H04B 1/04 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio frequency (RF) apparatus, comprising:
a circuit board having a first conductive surface forming an RF ground plane and a second conductive surface opposite to the first conductive surface;
a communication cable operably engaged with the circuit board;
at least two transmission lines formed on the second conductive surface of the circuit board and operably engaged with the communication cable; and
at least two connectors operably engaged with the at least two transmission lines and operably engaged with the second conductive surface of the circuit board;
wherein the RF apparatus is operable in a first configuration and a second configuration, wherein when in the first configuration, the RF apparatus is operable to divide a first RF signal into at least two RF signals, and wherein when in the second configuration, the RF apparatus is operable to combine the at least two RF signals into a second RF signal.