US 12,489,211 B2
Electronic device with patch antenna in packaging substrate
Harshpreet Singh Phull Bakshi, Dallas, TX (US); Rajen Manicon Murugan, Dallas, TX (US); and Sylvester Ankamah-Kusi, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Jan. 31, 2024, as Appl. No. 18/429,140.
Claims priority of provisional application 63/490,382, filed on Mar. 15, 2023.
Prior Publication US 2024/0313404 A1, Sep. 19, 2024
Int. Cl. H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/42 (2006.01)
CPC H01Q 9/0407 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 1/422 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a multilevel package substrate having a first level, a second level, and a third level, the first, second, and third levels each including a respective dielectric layer and patterned conductive features, the first, second, and third levels extending in respective first, second, and third planes of a first direction and an orthogonal second direction, the second level between the first and third levels along a third direction that is orthogonal to the first and second directions, the first level including a first trace layer with an antenna and a first via layer with a portion of a ground wall laterally spaced outward from and surrounding the antenna, and the second level including a second trace layer having a ground plane connected to the ground wall;
a semiconductor die attached to the first level of the multilevel package substrate; and
a package structure including a molding compound enclosing the semiconductor die and extending on a side of the antenna.