US 12,489,189 B2
Contactless communication using a waveguide extending through a substrate core
Telesphor Kamgaing, Chandler, AZ (US); Neelam Prabhu Gaunkar, Chandler, AZ (US); Georgios C. Dogiamis, Chandler, AZ (US); and Johanna M. Swan, Scottsdale, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 16, 2021, as Appl. No. 17/349,774.
Prior Publication US 2022/0407205 A1, Dec. 22, 2022
Int. Cl. H01P 3/16 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01P 11/00 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01)
CPC H01P 3/16 (2013.01) [H01L 21/486 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01P 11/006 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A package comprising:
a substrate with a core, the core having a first side and a second side opposite the first side;
a metal ring extending from the first side of the core to the second side of the core;
a waveguide disposed within the metal ring, the waveguide having an uppermost surface at a same level as the first side of the core, and the waveguide having a bottommost surface at a same level as the second side of the core;
a buildup layer with a first side and a second side opposite the first side, wherein the second side of the buildup layer is coupled with the first side of the core; and
a radiating element located in the buildup layer, the radiating element positioned above the waveguide, wherein the buildup layer is a first buildup layer and the radiating element is a first radiating element; and further comprising:
a second build up layer coupled with the second side of the core;
a second radiating element in the second build up layer positioned below the waveguide.