US 12,489,097 B2
Light emitting module combining enhanced safety features and thermal management
Lukas Steinmann, Singapore (SG); Hartmut Rudmann, Jona (CH); Mario Cesana, Au (CH); and Camilla Camarri, Au (CH)
Assigned to AMS SENSORS ASIA PTE. LTD., Singapore (SG)
Appl. No. 17/617,712
Filed by ams Sensors Asia Pte. Ltd., Singapore (SG)
PCT Filed Jun. 25, 2020, PCT No. PCT/SG2020/050359
§ 371(c)(1), (2) Date Dec. 9, 2021,
PCT Pub. No. WO2020/263184, PCT Pub. Date Dec. 30, 2020.
Claims priority of provisional application 62/867,456, filed on Jun. 27, 2019.
Prior Publication US 2022/0236381 A1, Jul. 28, 2022
Int. Cl. H01L 25/16 (2023.01); G01S 7/481 (2006.01); G01S 17/08 (2006.01); H01S 5/02 (2006.01); H01S 5/042 (2006.01); H01S 5/00 (2006.01)
CPC H01L 25/167 (2013.01) [G01S 7/4813 (2013.01); G01S 17/08 (2013.01); H01S 5/0206 (2013.01); H01S 5/042 (2013.01); H01S 5/005 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An optical module comprising:
an emitter configured to emit electromagnetic radiation;
a first substrate configured to support the emitter;
a driver configured to control the emitter;
a second substrate configured to support the driver, wherein the first substrate has a greater thermal conductivity than the second substrate; and
an optical assembly configured to modify an optical characteristic of the electromagnetic radiation,
wherein the optical assembly comprises an electrically conductive structure electrically coupled to the driver, and wherein the driver is configured to monitor an electrical characteristic of the electrically conductive structure.