US 12,489,095 B2
Semiconductor apparatus
Kenichiro Sato, Shiojiri (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on Sep. 29, 2022, as Appl. No. 17/955,711.
Claims priority of application No. 2021-184007 (JP), filed on Nov. 11, 2021.
Prior Publication US 2023/0146272 A1, May 11, 2023
Int. Cl. H01L 23/50 (2006.01); H01L 21/48 (2006.01); H01L 23/049 (2006.01); H01L 25/16 (2023.01); H02K 11/33 (2016.01); H02M 7/00 (2006.01); H01L 23/053 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 3/34 (2006.01)
CPC H01L 25/162 (2013.01) [H01L 21/4817 (2013.01); H01L 23/049 (2013.01); H01L 23/50 (2013.01); H02K 11/33 (2016.01); H02M 7/003 (2013.01); H01L 23/053 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H05K 3/3405 (2013.01); H05K 2201/10272 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor apparatus comprising:
a first connection terminal and a second connection terminal;
a drive circuit including one or more power semiconductor elements;
a control circuit configured to control the one or more power semiconductor elements;
a circuit substrate;
a passive element on the circuit substrate; and
a first bus bar and a second bus bar,
wherein:
the first bus bar includes:
a first body including a path electrically connecting the first connection terminal to the drive circuit; and
a first protrusion protruding toward the circuit substrate against the first body,
the second bus bar includes:
a second body including a path electrically connecting the second connection terminal and the drive circuit; and
a second protrusion protruding toward the circuit substrate against the second body, and
the passive element is electrically connected to the first protrusion and to the second protrusion.