US 12,489,080 B2
Flexible clip with aligner structure
Keunhyuk Lee, Suzhou (CN); Jerome Teysseyre, Singapore (SG); and Tiburcio A. Maldo, Consolacion (PH)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Feb. 16, 2024, as Appl. No. 18/444,180.
Application 18/444,180 is a continuation of application No. 17/658,885, filed on Apr. 12, 2022, granted, now 11,908,826.
Prior Publication US 2024/0194631 A1, Jun. 13, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/72 (2013.01) [H01L 24/90 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a die contact portion having a surface configured to contact a surface of a semiconductor die, the die contact portion being disposed at a first end of a clip preform; and
an aligner structure including a lead contact portion, the aligner structure configured to attach the lead contact portion to a lead post, the aligner structure being disposed at a second end of the clip preform,
the die contact portion and the aligner structure of the clip preform being included in a structure of a primary clip for connecting the semiconductor die to the lead post,
the clip preform being severable by removing a part of the die contact portion to form a secondary clip for connecting the semiconductor die to the lead post, and
the aligner structure and a remaining part of the die contact portion being included in a structure of a secondary clip.