US 12,489,070 B2
Electronic device and multilevel package substrate with integrated filter
Sylvester Ankamah-Kusi, Dallas, TX (US); Yiqi Tang, Allen, TX (US); Siraj Akhtar, Richardson, TX (US); and Rajen Murugan, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Sep. 27, 2022, as Appl. No. 17/954,178.
Prior Publication US 2024/0105647 A1, Mar. 28, 2024
Int. Cl. H01L 23/34 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H03H 7/01 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H03H 7/0115 (2013.01); H03H 7/0138 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/142 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a multilevel package substrate having a first level, a second level, and a filter circuit in the first and second levels, the filter circuit including a filter input terminal, a first capacitor, a first inductor, a second capacitor, a second inductor, a filter output terminal, and a reference terminal;
a semiconductor die attached to the multilevel package substrate and having a conductive structure coupled to one of the terminals of the filter circuit; and
a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.