US 12,489,067 B2
Industrial chip scale package for microelectronic device
Sreenivasan K Koduri, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Sep. 5, 2023, as Appl. No. 18/461,478.
Application 18/461,478 is a continuation of application No. 16/042,661, filed on Jul. 23, 2018, granted, now 11,749,616.
Claims priority of provisional application 62/568,340, filed on Oct. 5, 2017.
Prior Publication US 2024/0162163 A1, May 16, 2024
Int. Cl. H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/488 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/488 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/95 (2013.01); H01L 2224/03318 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05006 (2013.01); H01L 2224/05007 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05562 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/11312 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/1191 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13618 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13657 (2013.01); H01L 2224/13664 (2013.01); H01L 2224/13666 (2013.01); H01L 2224/13669 (2013.01); H01L 2224/1368 (2013.01); H01L 2224/13681 (2013.01); H01L 2224/13684 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17107 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83193 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A microelectronic device, comprising:
a die;
a first input/output (I/O) terminal and a second I/O terminal on the die;
a dielectric layer on the die;
a first column electrically coupled to the first I/O terminal and a second column electrically coupled to the second I/O terminal; and
a head electrically coupled to both the first column and the second column at an opposite end of each of the first and second columns from the first and second I/O terminals, the head extending through the dielectric layer, a portion of the head exposed from a surface of the microelectronic device, wherein the first I/O terminal and the second I/O terminal are on a same side of the die.