US 12,489,064 B2
Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark
Shih-Wei Chen, Hsinchu (TW); Po-Yuan Teng, Hsinchu (TW); Chiahung Liu, Hsinchu (TW); and Hao-Yi Tsai, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 20, 2023, as Appl. No. 18/099,715.
Claims priority of provisional application 63/428,907, filed on Nov. 30, 2022.
Prior Publication US 2024/0178152 A1, May 30, 2024
Int. Cl. H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/544 (2006.01); H10B 80/00 (2023.01)
CPC H01L 23/544 (2013.01) [H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H10B 80/00 (2023.02); H01L 2223/54406 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54433 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a mark, comprising:
providing a semiconductor device, wherein the semiconductor device comprises an interposer, a first redistribution structure, a second redistribution structure and a through hole structure, the first redistribution structure is located on a first side of the interposer, the second redistribution structure is located on a second side of the interposer, the first side is opposite to the second side, and the through hole structure passes through the interposer and connects with the first redistribution structure and the second redistribution structure;
forming a marking material on the first redistribution structure, the marking material comprising a resin, a curing agent, fillers and a solvent; and
sintering the marking material to make the resin cross-link and cure to form a cured product protruding from the first redistribution structure.