US 12,489,048 B2
Semiconductor package device having at least one second metal line between two adjacent first metal lines of redistribution layer
Te-Hsun Lin, Miao-Li County (TW); Wen-Hsiang Liao, Miao-Li County (TW); Mei-Yen Chen, Miao-Li County (TW); Ming-Hsien Shih, Miao-Li County (TW); Yung-Feng Chen, Miao-Li County (TW); and Cheng-Chi Wang, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Dec. 22, 2022, as Appl. No. 18/145,198.
Claims priority of application No. 202211460154.X (CN), filed on Nov. 17, 2022.
Prior Publication US 2024/0170385 A1, May 23, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 2924/15174 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor package device, comprising:
a chip;
a redistribution layer disposed corresponding to the chip and electrically connected to the chip, wherein the redistribution layer comprises a plurality of first metal lines and a plurality of second metal lines,
wherein, from a top view, at least one of the second metal lines is disposed between two adjacent first metal lines, an included angle between the at least one of the second metal lines and the two adjacent first metal lines is greater than or equal to 0 degrees and less than or equal to 10 degrees, and a first width of one of the two adjacent first metal lines is greater than a second width of the at least one of the second metal lines; and
a plurality of bonding pads corresponding to terminals of the first metal lines and the second metal lines, and a distance between two adjacent bonding pads is greater than or equal to 4 times the first width and less than or equal to 8 times the first width.