US 12,489,047 B2
Semiconductor device
Hideo Hara, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Appl. No. 17/928,128
Filed by ROHM CO., LTD., Kyoto (JP)
PCT Filed May 25, 2021, PCT No. PCT/JP2021/019732
§ 371(c)(1), (2) Date Nov. 28, 2022,
PCT Pub. No. WO2021/251126, PCT Pub. Date Dec. 16, 2021.
Claims priority of application No. 2020-099389 (JP), filed on Jun. 8, 2020.
Prior Publication US 2023/0207440 A1, Jun. 29, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4853 (2013.01); H01L 23/49861 (2013.01); H01L 25/16 (2013.01); H01L 23/3121 (2013.01); H01L 24/06 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06163 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49505 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a substrate having a substrate front surface and a substrate back surface facing away from each other in a thickness direction;
a conductive part made of an electrically conductive material and formed on the substrate front surface;
a semiconductor chip disposed on the substrate front surface;
a control unit that is disposed on the substrate front surface and controls the semiconductor chip;
a sealing resin that covers the semiconductor chip, the control unit, the conductive part and at least a portion of the substrate;
a conductive bonding material; and
a first lead bonded to the conductive part via the conductive bonding material and partially exposed from the sealing resin, wherein
the conductive part includes a first pad and a second pad disposed apart from each other, and
the first lead is bonded to the first pad and the second pad.