US 12,489,038 B2
Semiconductor device package
Younghwan Park, Seongnam-si (KR); Jongseob Kim, Seoul (KR); Jaejoon Oh, Seongnam-si (KR); Soogine Chong, Seoul (KR); and Sunkyu Hwang, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Oct. 26, 2023, as Appl. No. 18/495,697.
Application 18/495,697 is a division of application No. 17/192,439, filed on Mar. 4, 2021, abandoned.
Claims priority of application No. 10-2020-0149583 (KR), filed on Nov. 10, 2020.
Prior Publication US 2024/0055330 A1, Feb. 15, 2024
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01)
CPC H01L 23/49562 (2013.01) [H01L 21/4825 (2013.01); H01L 23/4951 (2013.01); H01L 23/49524 (2013.01); H01L 23/49551 (2013.01); H01L 23/49568 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device package comprising:
a lead frame;
a semiconductor device including a first face connected to the lead frame, a second face that faces the first face, a gate pad, a drain pad, and a source pad, the gate pad exposed on the second face of the semiconductor device, the drain pad exposed on the second face of the semiconductor device, and the source pad exposed on the second face of the semiconductor device;
a gate clip connected to the gate pad;
a drain clip connected to the drain pad;
a source clip connected to the source pad, the source clip connected to the lead frame; and
a molding configured to seal the lead frame, the semiconductor device, the source clip, the drain clip, and the gate clip,
wherein the source clip is integral with the lead frame, and
wherein the source clip and the lead frame is a single continuous piece that extends continuously from the first face of the semiconductor device to the second face of the semiconductor device.