US 12,489,033 B2
Silicon-based fan out package structure and preparation method therefor
Wei Wang, Beijing (CN); Yuchi Yang, Beijing (CN); and Jianyu Du, Beijing (CN)
Assigned to PEKING UNIVERSITY, Beijing (CN)
Appl. No. 18/024,389
Filed by PEKING UNIVERSITY, Beijing (CN)
PCT Filed Jun. 2, 2021, PCT No. PCT/CN2021/097815
§ 371(c)(1), (2) Date Mar. 2, 2023,
PCT Pub. No. WO2022/241848, PCT Pub. Date Nov. 24, 2022.
Claims priority of application No. 202110557585.7 (CN), filed on May 21, 2021.
Prior Publication US 2023/0317559 A1, Oct. 5, 2023
Int. Cl. H01L 23/473 (2006.01); H01L 21/48 (2006.01); H01L 23/427 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 21/4871 (2013.01); H01L 23/427 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A silicon-based fan out package structure comprising embedded manifold type microchannels, comprising:
a chip comprising a substrate and embedded microchannels located on a back of the substrate;
a silicon-based adapter plate comprising a groove for burying the chip, a manifold channel located within the groove, a liquid inlet and a liquid outlet, wherein the embedded microchannels are sealed to the manifold channel via sealing materials located between the chip and the silicon-based adapter plate; and
a rewiring layer at a top of the chip.