US 12,489,032 B2
Cooling of conformal power delivery structures
Feras Eid, Chandler, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); Henning Braunisch, Phoenix, AZ (US); Adel Elsherbini, Chandler, AZ (US); Thomas L. Sounart, Chandler, AZ (US); and Johanna Swan, Scottsdale, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 24, 2021, as Appl. No. 17/484,384.
Prior Publication US 2023/0098020 A1, Mar. 30, 2023
Int. Cl. H01L 23/473 (2006.01); H01L 23/31 (2006.01); H01L 23/50 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 23/31 (2013.01); H01L 23/50 (2013.01); H05K 7/20263 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An integrated circuit component comprising:
a die;
a backside power plane mated with the die; and
a lid mated with the backside power plane to create a seal between the lid and the backside power plane,
wherein the lid comprises an inlet and an outlet, wherein a channel is defined between the inlet and the outlet for liquid coolant to flow from the inlet, over the backside power plane, and to the outlet,
wherein the backside power plane is a conformal power delivery structure,
wherein the conformal power delivery structure comprises:
a first electrically conductive layer comprising metal, the first electrically conductive layer defining one or more recesses;
a second electrically conductive layer comprising metal, the second electrically conductive layer at least partially within the one or more recesses of the first electrically conductive layer and having a lower surface that generally conforms with an upper surface of the first electrically conductive layer; and
a dielectric material between the surfaces of the first electrically conductive layer and the second electrically conductive layer that conform with one another.