US 12,489,030 B2
Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure
Hao-Jan Pei, Hsinchu (TW); Wei-Yu Chen, Taipei (TW); Chia-Shen Cheng, Hsinchu (TW); Chih-Chiang Tsao, Taoyuan (TW); Cheng-Ting Chen, Taichung (TW); Chia-Lun Chang, Tainan (TW); Chih-Wei Lin, Zhubei (TW); Hsiu-Jen Lin, Zhubei (TW); Ching-Hua Hsieh, Hsinchu (TW); and Chung-Shi Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jan. 4, 2024, as Appl. No. 18/404,504.
Application 16/569,898 is a division of application No. 15/940,623, filed on Mar. 29, 2018, granted, now 10,566,261, issued on Feb. 18, 2020.
Application 18/404,504 is a continuation of application No. 17/227,790, filed on Apr. 12, 2021, granted, now 11,901,258.
Application 17/227,790 is a continuation of application No. 16/569,898, filed on Sep. 13, 2019, granted, now 10,978,370, issued on Apr. 13, 2021.
Claims priority of provisional application 62/586,587, filed on Nov. 15, 2017.
Prior Publication US 2024/0153842 A1, May 9, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01)
CPC H01L 23/3736 (2013.01) [H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3677 (2013.01); H01L 23/50 (2013.01); H01L 23/5389 (2013.01); H01L 24/83 (2013.01); H01L 25/105 (2013.01); H01L 23/49816 (2013.01); H01L 2224/18 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming a first redistribution structure over a carrier;
attaching a backside of a die to a first side of the first redistribution structure;
forming a conductive pillar on the first side of the first redistribution structure;
surrounding the die and the conductive pillar with a molding material;
forming a second redistribution structure over the die, the conductive pillar, and the molding material;
after forming the second redistribution structure, forming a first opening extending through the first redistribution structure, the first opening being within lateral extents of the die;
filling the first opening with a metal paste, the metal paste comprising an adhesive material and metal particles dispersed in the adhesive material; and
performing a reflow process to cure the metal paste.