US 12,489,027 B2
Semiconductor device and method of manufacture
Shu-Shen Yeh, Taoyuan (TW); Chin-Hua Wang, New Taipei (TW); Chia-Kuei Hsu, Hsinchu (TW); Po-Yao Lin, Zhudong Township (TW); and Shin-Puu Jeng, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 2, 2024, as Appl. No. 18/624,903.
Application 18/624,903 is a continuation of application No. 18/312,877, filed on May 5, 2023, granted, now 11,973,001.
Application 18/312,877 is a continuation of application No. 17/246,035, filed on Apr. 30, 2021, granted, now 11,682,602, issued on Jun. 20, 2023.
Claims priority of provisional application 63/145,631, filed on Feb. 4, 2021.
Prior Publication US 2024/0249994 A1, Jul. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first semiconductor device bonded to an interposer;
an encapsulant encapsulating the first semiconductor device, wherein a first surface comprises the encapsulant and the first semiconductor device;
a first lid bonded to a first corner of the first surface;
a second lid bonded to a second corner of the first surface, the second corner being different from the first corner; and
a ring located around the encapsulant.