US 12,489,026 B2
Heating element and supporting circuitry for adapting a nominally rated semiconductor chip to an extremely cold environment
Aslam Haswarey, Portland, OR (US); Kevin Wells, Folsom, CA (US); Mehran Adyani-Yazdi, Hillsboro, OR (US); Daniel R. Russell, Hillsboro, OR (US); James C. Mowery, Beaverton, OR (US); Vinesh Lal, Beaverton, OR (US); and Xiangying Ma, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 24, 2020, as Appl. No. 16/858,457.
Claims priority of provisional application 62/839,535, filed on Apr. 26, 2019.
Prior Publication US 2020/0258804 A1, Aug. 13, 2020
Int. Cl. H01L 23/34 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H10D 89/10 (2025.01)
CPC H01L 23/345 (2013.01) [H05K 1/0212 (2013.01); H05K 1/181 (2013.01); H10D 89/105 (2025.01)] 14 Claims
OG exemplary drawing
 
1. A thermal control circuit, comprising:
a heating element disposed within an electronic circuit board having a semiconductor chip disposed thereon; and,
a power management integrated circuit coupled to the heating element, the power management integrated circuit to enable the heating element to heat the semiconductor chip to within the semiconductor chip's rated operating temperature range prior to the semiconductor chip being placed in an operational state.