US 12,489,024 B2
Electronics module with shield structure
Shota Hayashi, Nagaokakyo (JP); Nobuaki Ogawa, Nagaokakyo (JP); Yuki Asano, Nagaokakyo (JP); Takanori Uejima, Nagaokakyo (JP); Hiromichi Kitajima, Nagaokakyo (JP); Takahiro Eguchi, Nagaokakyo (JP); and Kunitoshi Hanaoka, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto-fu (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Feb. 9, 2023, as Appl. No. 18/166,534.
Application 18/166,534 is a continuation of application No. PCT/JP2021/027643, filed on Jul. 27, 2021.
Claims priority of application No. 2020-136645 (JP), filed on Aug. 13, 2020; application No. 2021-005120 (JP), filed on Jan. 15, 2021; and application No. 2021-020452 (JP), filed on Feb. 12, 2021.
Prior Publication US 2023/0187297 A1, Jun. 15, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2023.01); H05K 9/00 (2006.01)
CPC H01L 23/3157 (2013.01) [H01L 23/498 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 25/165 (2013.01); H05K 9/0024 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate having an upper main surface and a lower main surface arranged in an up-down direction;
a metal member including a plate-shaped portion provided on the upper main surface of the substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction;
a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member;
a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member;
a sealing resin layer provided on the upper main surface of the substrate, covering the metal member, the first electronic component, and the second electronic component, and having an upper surface; and
a shield provided on the upper surface of the sealing resin layer so as to be connected to an upper end of the plate-shaped portion, wherein
the thickness of the plate-shaped portion is uniform, the plate-shaped portion is inclined with respect to the up-down direction such that the upper end of the plate-shaped portion is located behind a lower end of the plate-shaped portion, and the upper end of the plate-shaped portion is a plane that forms an acute angle with respect to the front main surface that forms an acute angle with respect to the front main surface of the plate-shaped portion and an obtuse angle with respect to the back main surface of the plate-shaped portion,
or the thickness of the plate-shaped portion is uniform, the plate-shaped portion is inclined with respect to the up-down direction such that the upper end of the plate-shaped portion is located in front of the lower end of the plate-shaped portion, and the upper end of the plate-shaped portion is a plane that forms an obtuse angle with respect to the front main surface of the plate-shaped portion and an acute angle with respect to the back main surface of the plate-shaped portion.