US 12,489,008 B2
Black wheels for transporting ultra-thin silicon wafer
Muren Bao, Tianjin (CN); and Feiyang Li, Tianjin (CN)
Assigned to TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD., Tianjin (CN)
Appl. No. 18/548,084
Filed by TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD., Tianjin (CN)
PCT Filed Jul. 31, 2023, PCT No. PCT/CN2023/110387
§ 371(c)(1), (2) Date Aug. 26, 2023,
PCT Pub. No. WO2024/041324, PCT Pub. Date Feb. 29, 2024.
Claims priority of application No. 202222251649.3 (CN), filed on Aug. 25, 2022.
Prior Publication US 2025/0038026 A1, Jan. 30, 2025
Int. Cl. B65H 3/48 (2006.01); B28D 5/00 (2006.01); B65G 49/06 (2006.01); B65H 5/22 (2006.01); B65H 29/54 (2006.01); B65H 29/56 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67718 (2013.01) [B28D 5/0082 (2013.01); B65G 49/068 (2013.01); B65H 3/48 (2013.01); B65H 5/22 (2013.01); B65H 29/54 (2013.01); B65H 29/56 (2013.01); H01L 21/67706 (2013.01); B65H 2404/13161 (2013.01); B65H 2406/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A black wheel for transporting an ultra-thin silicon wafer to a next process device, comprising grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel,
wherein compressed air lines are fixed onto a guard plate of the next process device and respectively accommodated within the grooves;
during a process of transporting the ultra-thin silicon wafer,
the black wheel is configured to keep rotating such that the ultra-thin silicon wafer is first absorbed onto the side surface of the black wheel and then transported towards the next process device;
the grooves are configured to avoid the compressed air lines such that the black wheel, the ultra-thin silicon wafer absorbed onto the side surface of the black wheel, and the compressed air lines are not interfered with each other; and
the compressed air lines are configured to blow an end of the ultra-thin silicon wafer absorbed onto the side surface of the black wheel away from the side surface when the end of the ultra-thin silicon wafer approaches the next process device, such that the end of the ultra-thin silicon wafer blown away from the side surface is transported onto the next process device.