US 12,489,005 B2
Temperature-based metrology calibration at a manufacturing system
Shifang Li, Pleasanton, CA (US); Yudong Hao, Fremont, CA (US); Xinyuan Chong, Milpitas, CA (US); and Chengqing Wang, Cupertino, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on Mar. 31, 2022, as Appl. No. 17/710,779.
Prior Publication US 2023/0317481 A1, Oct. 5, 2023
Int. Cl. H01L 21/67 (2006.01); B24B 49/04 (2006.01); C23C 14/54 (2006.01)
CPC H01L 21/67248 (2013.01) [B24B 49/04 (2013.01); C23C 14/541 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method comprising:
obtaining, by a set of one or more processing devices, first metrology data representing one or more features of a substrate, wherein the substrate is at a first temperature following a completion of a substrate process at a manufacturing system;
determining, by the set of one or more processing devices and in view of calibration data associated with the substrate, second metrology data representing the one or more features of the substrate at a second temperature, wherein the second temperature is different from the first temperature; and
responsive to determining, in view of the second metrology data, that a modification criterion associated with the substrate process is satisfied, modifying, by the set of one or more processing devices, a substrate process recipe associated with the substrate process.