US 12,489,001 B2
Wet etch apparatus
Hong-Ting Lu, Taichung (TW); and Han-Wen Liao, Taichung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Jul. 31, 2024, as Appl. No. 18/791,036.
Application 18/791,036 is a division of application No. 17/460,209, filed on Aug. 28, 2021, granted, now 12,249,520.
Application 17/460,209 is a division of application No. 16/437,775, filed on Jun. 11, 2019, granted, now 11,107,707, issued on Aug. 31, 2021.
Claims priority of provisional application 62/771,461, filed on Nov. 26, 2018.
Prior Publication US 2024/0395572 A1, Nov. 28, 2024
Int. Cl. H01L 21/67 (2006.01); C25F 3/02 (2006.01); C25F 3/12 (2006.01); H01L 21/306 (2006.01); H01L 21/3063 (2006.01); H01L 21/3213 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H10D 64/01 (2025.01)
CPC H01L 21/6708 (2013.01) [C25F 3/02 (2013.01); C25F 3/12 (2013.01); H01L 21/306 (2013.01); H01L 21/30604 (2013.01); H01L 21/30608 (2013.01); H01L 21/3063 (2013.01); H01L 21/32133 (2013.01); H01L 21/32134 (2013.01); H01L 21/6831 (2013.01); H01L 21/687 (2013.01); H10D 64/017 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A wet etch apparatus, comprising:
a wafer chuck;
a dispensing nozzle above the wafer chuck;
a rail extending at least from a first position aligned laterally with the wafer chuck to a second position higher than a top surface of the wafer chuck;
first and second vehicles movable along the rail; and
an electric field generator operative to generate an electric field across the wafer chuck, wherein the electric field generator comprises a first electrode carried by the first vehicle and a second electrode carried by the second vehicle.