| CPC H01J 37/32715 (2013.01) [H02N 13/00 (2013.01); H01J 2237/2007 (2013.01)] | 13 Claims |
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1. A substrate fixing device comprising:
a base plate having a first through-hole penetrating through the base plate in a thickness direction of the base plate;
a ceramic plate adhering to the base plate, having an electrode embedded in the ceramic plate and a second through-hole formed to communicate with the first through-hole, and configured to adsorb an adsorption target object by an electrostatic force that is generated when a voltage is applied to the electrode;
an insulating plug arranged at a connection portion in the first through-hole connecting to the second through-hole;
a sealing member attached to the insulating plug and configured to seal a periphery of the connection portion; and
an adhesive material configured to bond the base plate and the ceramic plate, the adhesive material being provided between the base plate and the ceramic plate,
wherein
the first through-hole has an opening portion connecting to the second through-hole at the connection portion, and a spot facing portion provided in the opening portion,
the insulating plug is arranged in the spot facing portion,
the sealing member is disposed to separate a space in which the insulating plug is arranged from a space in which the adhesive material is arranged, with the sealing member in contact with an entirety of a side surface of the adhesive material facing the first through-hole, and
the sealing member has one end surface in a vertical direction in contact with a surface of the ceramic plate and the other end surface in the vertical direction in press contact with the insulating plug.
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