US 12,488,965 B2
Device and method for treating substrate
Zi-Wei Zhu, Hsinchu (TW); and Shao-Yong Chen, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Apr. 27, 2022, as Appl. No. 17/730,813.
Prior Publication US 2023/0352277 A1, Nov. 2, 2023
Int. Cl. H01J 37/32 (2006.01); H01L 21/683 (2006.01); H05B 1/02 (2006.01)
CPC H01J 37/32642 (2013.01) [H01J 37/32724 (2013.01); H01L 21/6833 (2013.01); H05B 1/0233 (2013.01); H01J 2237/3341 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
disposing a substrate on a substrate retainer;
setting positions of upper ring segments which are disposed around the substrate retainer and which are angularly displaced from each other to constitute an upper ring, such that an inner edge of each of the upper ring segments is spaced apart from an outer periphery of the substrate by a predetermined distance; and
performing a treatment on the substrate after setting the positions of the upper ring segments.