US 12,488,945 B2
Multilayer electronic component
Chan Hee Nam, Suwon-si (KR); Oh Hun Gwon, Suwon-si (KR); Jae Hyun Park, Suwon-si (KR); Kwan Yeol Paek, Suwon-si (KR); Chang Geon Lee, Suwon-si (KR); and Hae Suk Chung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 20, 2023, as Appl. No. 18/390,621.
Claims priority of application No. 10-2022-0184401 (KR), filed on Dec. 26, 2022.
Prior Publication US 2024/0212941 A1, Jun. 27, 2024
Int. Cl. H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/2325 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer and an internal electrode; and
external electrodes disposed on the body,
wherein the dielectric layer includes a plurality of dielectric grains having a perovskite-based composition represented by ABO3, the A includes a first element including at least one of Bi, Na, K, Sr, and Ca, and the B includes a second element including Ti,
wherein at least one of the plurality of dielectric grains has a core-shell structure including a core portion on an internal side and a shell portion covering at least a portion of the core portion, and a content of the first element included in the core portion is twice or more than a content of the first element included in the shell portion, and
wherein the core portion includes a first core portion on an internal side and a second core portion covering at least a portion of the first core portion, and the second core portion includes Zr.